Product Name |
AMAOE MP:1 Qualcomm PM MTK MT Power IC 0.12MM reballing stencil MT6355W MT6356W MT6357V MT6358W PM660 PM670 MP6335 PM545 PM540 PMI632 PM640 MT6336 MT6330 MT6370P MT6371P MP1 steel mesh |
Item NO. |
1318294 |
Smart device Brand |
Android, Samsung |
BGA reballing kit |
Stencil |
Weight |
0.04 kg = 0.0882 lb = 1.4110 oz |
Category |
Phone repair tools
> BGA reballing kit
|
Tag |
660
, PM
, MTK
, MTK stencil
, 640
, Android stencil
, 0.12mm stencil
, 0.12mm
, PM640
, PM540
, PM670
, PM660
, MT6356W
, MT6371P
, power ic
, power ic stencil
, 540
, 670
, 6356
, power stencil
, MT
, 6371
, Samsung stencil
, Qualcomm
, MT6357
, 6357
, PM stencil
, MT stencil
, Android power stencil
, MP1
, Qualcomm stencil
, PMI632
, 632
, AMAOE 0.12MM stencil
, Samsung 0.12MM stencil
, Samsung power stencil
, Samsung power ic stencil
, Android power ic stencil
, AMAOE power stencil
, MT6355W
, MT6355
, 6355
, MT6356
, MT6357V
, MT6358W
, MT6358
, 6358
, MP6335
, 6335
, PM545
, 545
, MT6336
, 6336
, MT6330
, 6330
, MT6370P
, 6370P
, MT6370
, 6370
, MT6371
, 6371P
|
Brand |
AMAOE |
Creation Time |
2020-06-22 |
No related record found