Product Name | AMAOE EMMC EMCP Font BGA chip reballing stencil 0.15MM steel mesh for BGA153/162/169/186/221/254 |
Item NO. | 1318330 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | EMMC , 0.15mm , BGA , eMCP , 162 , EMMC stencil , 0.15mm stencil , 254 , 153 , BGA153 , BGA254 , BGA162 , BGA221 , BGA169 , BGA186 , font stencil , Font , Samsung Font stencil , BGA chip stencil , EMCP stencil , AMAOE font stencil , Samsung BGA stencil , Android front stencil , Android BGA stencil , 0.15MM font stencil , BGA chip , 0.15MM steel mesh , BGA221 stencil , 221 , BGA153 stencil , BGA169 stencil , 169 , BGA254 stencil , BGA162 stencil , BGA186 stencil , 186 |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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