Product Name | AMAOE MSM8973 reballing stencil 0.12MM thickness CPU steel mesh cooling holes anti drum design |
Item NO. | 1318440 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | CPU Stencil , MSM stencil , Android stencil , 0.12mm stencil , 0.12mm , Android CPU stencil , Samsung CPU stencil , Samsung stencil , MSM , AMAOE CPU stencil , 0.12mm CPU stencil , AMAOE 0.12MM stencil , AMAOE MSM stencil , MSM8973 , MSM8973 stencil , 8973 , Android MSM stencil , Samsung MSM stencil , 0.12MM MSM stencil |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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