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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 (WhatsApp)
E-mail:Service@tuolitech.com


AMAOE MSM8973 reballing stencil 0.12MM thickness CPU steel mesh cooling holes anti drum design

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AMAOE MSM8973 reballing stencil 0.12MM thickness CPU steel mesh cooling holes anti drum design Item NO.: 1318440

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Product Name AMAOE MSM8973 reballing stencil 0.12MM thickness CPU steel mesh cooling holes anti drum design
Item NO. 1318440
Smart device Brand Android, Samsung
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz
Category Phone repair tools > BGA reballing kit
Tag CPU Stencil , MSM stencil , Android stencil , 0.12mm stencil , 0.12mm , Android CPU stencil , Samsung CPU stencil , Samsung stencil , MSM , AMAOE CPU stencil , 0.12mm CPU stencil , AMAOE 0.12MM stencil , AMAOE MSM stencil , MSM8973 , MSM8973 stencil , 8973 , Android MSM stencil , Samsung MSM stencil , 0.12MM MSM stencil
Brand AMAOE
Creation Time 2020-06-22

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