| Product Name |
AMAOE U9 CPU reballing kit 0.12MM MSM8905/8909 steel mesh / U9 position plate / magnetic base |
| Item NO. |
1318968 |
| Smart device Brand |
Android, Samsung |
| BGA reballing kit |
Stencil |
| Weight |
0.55 kg = 1.2125 lb = 19.4007 oz |
| Category |
Phone repair tools
> BGA reballing kit
|
| Tag |
CPU Stencil
, MSM stencil
, MSM8909
, Android stencil
, 0.12mm stencil
, 0.12mm
, Android CPU stencil
, Samsung CPU stencil
, Samsung stencil
, Magnetic base
, MSM
, AMAOE CPU stencil
, 0.12mm CPU stencil
, MSM CPU stencil
, AMAOE 0.12MM stencil
, AMAOE magnetic base
, 0.12MM steel mesh
, 8909
, U9
, U9 position plate
, MSM8905/8909
, MSM8905/8909 stencil
, MSM8905
, MSM8905 stencil
, 8905
, MSM8909 stencil
|
| Brand |
AMAOE |
| Creation Time |
2020-06-22 |
No related record found