Product Name | BST Bga Solder Ball Size For Micro Welding Soldering Ball Diameter 0.2/0.3/0.4/0.5/0.6mm |
Item NO. | 1238809 |
BGA reballing kit | Solder balls |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools |
Tag | solder ball , bst , BEST , soldering ball , ball |
Brand | BST |
Creation Time | 2020-08-14 |
No related record found