Product Name | AMAOE Huawei samsung middle layer tin planting mesh vivo motherboard middle layer steel mesh |
Item NO. | 2163938 |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | iP13 stencil , Magic3 stencil , huawei mate xs2 stencil , mate xs2 stencil , mate xs2 layer tin planting mesg , SAM16 stencil , pad mt8795z stencil , 1+10pro stencil , xiaomi 12 pro , ov7 stencil , hw17 stencil , vivo x80 pro stencil , mi16 stencil , xiaomi 12s stencil , bga304 stencil |
Brand | AMAOE |
Creation Time | 2022-11-02 |
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